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  Welcome to IDF, snowboarding and more 
  Feb 25, 2002, 06:00pm EST 
 
By: Sander Sassen

Good afternoon, looks like Dan has been covering for me in my absence and in the meanwhile I’ve spent most of today looking at new Intel products and attending some of the keynotes. I’m sure you’ll be able to find most of the tech details on the Intel and other respective company’ websites so I won’t bother you with those too much. I however have a number of fun items for you to look at that I came across that I’m sure will amuse you too.

The first item is a piece of the keynote from Intel President and CEO Craig R. Barret that he held to officially start IDF off with. I think I can quickly and safely summarize his keynote by saying he advocated the need for broadband internet access throughout the United States and the rest of the world to further speed up the internet revolution. He made some analogies towards previous advances in technology, for example the industrial revolution back in the 1800s, which changed society and pushed civilization forward.



Fig 1. Craig R. ‘Extreme Snowboarder’ Barret footage, this movie requires the Windows Media player to be installed and requires a broadband connection for streaming playback.

Craig definitely raised some eyebrows with the above footage. With help from the Realviz software some of the Intel engineers made a trip down to Embarcadero road and took a number of digital photos that were subsequently rendered into a full 3D animated sequence that has Craig R. Barret riding a snowboard in a halfpipe and over a Muni light rail car. He then went on to talk about the need for multiple GHz processors to be able to properly decompress live video streams without compromising playback quality.



Fig 2. Intel chip manufacturing footage, this movie requires the Windows Media player to be installed and requires a broadband connection for streaming playback.

The above footage is very good overview of advances that Intel has made in the new 0.13-micron 300mm process technology. The footage basically covers the need to move to 300mm wafers to reduce cost and increase manufacturing efficiency. To my opinion this was one of the most insightful PR material Intel releases today as it enables you to take a look at what complex engineering goes into manufacturing state-of-the-art semiconductors.

Sander Sassen.

 

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