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  Kentron Introduces 1Gigabyte DDR333 Registered ECC Modules 
  Jul 19, 2002, 12:00pm EDT 
 
Wilmington, MA, (July 19, 2002) - Kentron Technologies (http://www.kentrontech.com), a leader in advanced memory platforms, today announced the availability of 1 Gigabyte (1GB), DDR333, Registered, low profile (1.20 - inches in profile height) memory modules supporting ECC. The KT12872DRN6RXX-V5 has been designed utilizing the company's non-stacking, high density memory technology, "FEMMA" (Foldable Electronic Memory Module Assembly). FEMMA is a non-stacking technology that eliminates the high costs, yield issues and production delays associated with the memory device stacking alternative.

The 1.20", 1GB, DDR333 memory module is built with 36 individual TSOP-II (Thin Small Outline Package) 256Megabit (256Mb) memory chips arranged in two banks for a total of 128MB x 72. It is a 184-pin, 2.5 Volt, standard DDR memory module that follows JEDEC (Joint Electronic Engineering Device Council - http://www.jedec.org) specifications. The module measures 1.20" H. x 5.25" L. x 0.32" W., making it ideal for applications where space is constrained.

DDR AND FEMMA TECHNOLOGY: A POWERFUL COMBINATION
The powerful combination of DDR and FEMMA in a high density module provides the marketplace with a very cost effective solution. The demand for high speed, high density memory modules has increased, as the popularity of "space saving" servers, such as the rack-mount, blade, hyper dense and 1U market place grows. Low powered, high speed, high density, dependable memory modules are the key components to achieve the performance expected of these ultra dense servers.

PRICE/PERFORMANCE EFFECTIVE SOLUTIONS AVAILABLE FOR THE MARKET PLACE
Kentron's DDR FEMMA line of memory modules (512MB - 1GB, DDR200/266/333) are low cost, high speed/high density memory DIMMs that maintain a similar cost structure when compared to PC100/133 solutions and are much lower cost than the stacking alternative in the marketplace. This allows Kentron to offer its clients with reliable solutions that will ultimately benefit their bottom line.
"Kentron's PC2700 / DDR333 modules use standard non-stacked, TSOP DRAM devices. This allows us to produce a high-density, low-profile design with minimum impact to manufacturing cost, said Tom Mullen, Kentron's Director of Sales. "The 1GB Module combines the highest density available in the marketplace today with latest DRAM Technology (PC2700 / DDR333)," concluded Mullen.

The 1 Gigabyte (1GB), DDR 333, Registered, ECC, 1.20-inch-high, memory module is now available. Pricing for these modules is $495.00; interested parties should contact Joe Capaldo (jcapaldo@kentrontech.com) Product Marketing Manager for Kentron Technologies at (978) 988-9100 ext. 2136 for more information.

ABOUT KENTRON TECHNOLOGIES
Founded in 1996, Kentron Technologies specializes in the design, engineering and manufacturing of high density present and next-generation memory products and platforms to meet the speed and density requirements of high performance systems. With patented memory solutions, Kentron is pioneering new technologies that will lay the foundation for future platforms and networks and solve the memory density and speed issues faced by the Internet server and router marketplace. These memory platforms achieve the highest "per socket" densities in the world without the premium costs that might be expected of such leading edge technology. Kentron manufactures its products in three locations in the United States and maintains a world-class engineering and R&D facility in Massachusetts. Kentron Technologies corporate headquarters is based at 155 West Street in Wilmington. MA.

Additional information is available at the Company's website http://www.kentrontech.com.

 

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