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  IBM and AMD Join Forces in Chip Manufacturing 
  Jan 10, 2003, 12:00pm EST 
SUNNYVALE, CALIF, and EAST FISHKILL, N.Y. -- January 8, 2003 --AMD (NYSE: AMD) and IBM (NYSE: IBM) today announced the two companies have entered into an agreement to jointly develop chip-making technologies for use in future high-performance products.

The new processes, developed by AMD and IBM, will be aimed at improving microprocessor performance and reducing power consumption, and will be based on advanced structures and materials such as high-speed silicon-on-insulator (SOI) transistors, copper interconnects and improved "low-k dielectric" insulation.

The agreement includes collaboration on 65 and 45nm (nanometer; a billionth of a meter) technologies to be implemented on 300mm (millimeter) silicon wafers.

"We are set to commence production of our 90nm solutions in the fourth quarter of 2003, so we are now expanding process-technology development efforts for our next generation of processors targeted at 65nm and below," said Bill Siegle, senior vice president, technology operations and chief scientist at AMD. "By collaborating with an industry leader like IBM, AMD can deliver industry-leading performance and functionality for our customers while reducing the rapidly escalating cost of technology development."

AMD and IBM will be able to use the jointly-developed technologies to manufacture products in their own chip fabrication facilities and in conjunction with selected manufacturing partners. The companies expect first products based on the new 65nm technologies to appear in 2005.

"Today's marketplace demands the most advanced chip designs and materials technologies," said Bijan Davari, IBM Fellow and vice president, technology and emerging products, IBM Microelectronics Division. "Our work with AMD is all about speeding our joint technologies into products, and helping reduce the time-to-market for customers."

The development will be supported by AMD and IBM engineers working together in IBM’s Semiconductor Research and Development Center (SRDC) in IBM's East Fishkill, N.Y. facility. Work is expected to begin by January 30, 2003.

About AMD
AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets with manufacturing facilities in the United States, Europe, Japan, and Asia. AMD, a Fortune 500 and Standard & Poor’s 500 company, produces microprocessors, Flash memory devices, and support circuitry for communications and networking applications. Founded in 1969, AMD is based in Sunnyvale, California. (NYSE: AMD).

AMD on the Web
For more AMD news and product information, please visit our virtual pressroom at Additional press releases are available at

About IBM Microelectronics
IBM Microelectronics is a key contributor to IBM's role as the world's premier information technology supplier. IBM Microelectronics develops, manufactures and markets state-of-the-art semiconductor, ASIC and interconnect technologies, products and services. Its superior integrated solutions can be found in many of the world's best-known electronic brands.

IBM is a recognized innovator in the chip industry, having been first with advances like more power-efficient copper wiring in place of aluminum, faster silicon-on-insulator (SOI) and silicon germanium transistors, and improved low-k dielectric insulation between chip wires. These and other innovations have contributed to IBM's standing as the number one U.S. patent holder for nine consecutive years. More information about IBM Microelectronics can be found at:


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